Arung arai jahpan
AOI Automatic optical jep joi ai arung arai ni hpe lang nna, packaged chips ni hta ja wire matut mahkai ai lam ni a hkam kaja lam hte hkrak ai lam hpe mu lu ai. Dai gaw, packaged chips ni hta ja wire matut mahkai lam ni hpe lawan ai hku nna hkrak hkrak sawk sagawn lu na matu, 2D/3D camera ni hte AI sumla galaw ai ladat ni hpe lang nna, tsaw ai{1}}resolution hpe lang ai. Dai gaw, ja wire a welding masa, shara, galu kaba ai lam, n-gun n rawng ai, kaga parameters ni hpe mu lu nna, n kaja ai welding, breakage, offset, hte kaga manghkang ni zawn re ai anomalies (sh) defects amyu myu hpe chye ginhka lu ai. Ja wire matut mahkai lam ni hta manghkang ni hpe lawan ai hku mu tam nna gram lajang ai hku nna, packaged chips ni a quality hte kam hpa mai ai lam hpe grau kaja hkra galaw ya lu nna, chips ni a n kaja ai rate hpe shayawm ya lu ai.

AOI Gold wire bonding
Product Features ni
1.Gold wire matut mahkai lam hpe jep joi ai lam
In bonding wire ni a morphological parameters (galaw majaw ja, magri (sh) aluminum wires) ni hpe sawk sagawn nna, wire arc a tsaw ai, galu kaba ai, shara, diameter, diameter, diameter, n-gun yawm ai, n-gun n rawng ai, short circuit hte kaga n kaja ai lam ni lawm ai.
2.Solder joint quality hpe sawk sagawn ai lam
Buping points (first solder joint, second solder joint) a dinghpring ai lam hpe jep yu u.
3.3D hkrang hpe bai gawgap ai lam
Nkau mi gaw, n-gun kaba ai-end model ni gaw, multi{2}}}angle optical imaging (sh) laser scanning hku nna, ja wire hpe 3D profile shadawn ai lam hpe lu la mai ai.
Product a arung arai ni
AOI arung arai ni a laklai ai optical system hte sawk sagawn ai ladat hpe tsaw ai, n-gun kaba ai, tsaw ai-senitivity crystal n kaja ai lam hpe mu tam ai hte garan ginhka ai lam ni a matu jai lang ai.
2D & 3D lata la mai ai lam, 3D shadawn ai Z{3}}}axis a hkrak ai lam 8 μm du hkra hkrak ai.
UPH: 5000pcs/h hta grau kaba ai (sh) maren sha re.

AOI 2D sawk sagawn ai lam

AOI 3D sawk sagawn ai lam
Arung
● AOI arung arai ni hpe jep joi ai lam ni: n-gun n rawng ai wire, n kaja ai wire, n kaja ai wire, wire arc lahkawng, n kaja ai wire arc, ja wire n kaja ai, ja wire kadun ai, ja wire kadun ai, nga ni a ball hpe garan kau ai, nga hkwi ai ball hpe garan kau ai, solder ball hpe n-gun, nga ni a ball hpe offset, nga hkwi ai n-gun, nga hkwi ai lam, n-gun n rawng ai, capacitor detachment, capacator offset, lup makoi ai, awu asin re ai mawdaw gau ai wa hpe offset galaw ai. IC, tsan gang mat ai mawdaw gau ai IC, n san seng ai mawdaw gau ai IC, n-gun n rawng ai chip, n-gun n rawng ai chip, n san seng ai n-gun rawng ai chip.
AOI Automatic optical jep joi ai arung arai ni gaw, bonding galaw ai lam a kam hpa mai ai lam hpe kam mai na matu ahkyak ai link langai rai nna, semiconductor a n-gun hpe n-gun jaw ai lam hta, n-gun dat hpe n-gun jaw ai lam hta, grai law hkra jai lang nga ai. Nang grau kaja ai hparan ladat ra ai rai yang, Huizhou Zhongke Advanced Manufacturing Co., Ltd hpe san yu u.
Hot Tags: automatic optical jep joi ai arung arai ni, Miwa gaw optical jep joi ai arung arai ni hpe galaw shapraw ai ni, dut shabra ai ni, jak rung ni
Technical Parameters ni
● Hpaji jaw ai lam: 0.5μm~5μm ( lens hpe gram lajang ai hta hkan nna)
2
● Shapraw mai ai wire diameter: 15μm~100μm (ja wire/copper wire)
● bai kahtap mai ai lam: ±1μm3μm
Arung arai ni hpe masat da ai lam
|
Shinggan na kaba ai Size |
L1000*W800*H1500 mm. |
|
dat kasa |
2KW, AC220 V |
|
Shen yu ai |
800Kg |








