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Semiconductor jep joi ai arung arai ni

Semiconductor jep joi ai arung arai ni

MPC semiconductor hpe jep joi ai arung arai ni gaw CMOS sumla sensor ni a matu hkum tsup ai hku nna, hkum tsup ai hku nna, n-gun rawng ai hku nna, n-gun rawng ai hku nna, n-gun rawng ai hku nna, n-gun n rawng ai hku n-gun dat dat ai ladat langai rai nga ai. Dai hta, ultrafine maigan matter hpe chye na lu ai, n-gun ja ai n-gun n-gun hpe yeng seng kau lu na matu, ga nhpu n-gun rawng ai ladat hpe lam madun ya lu ai, tsaw ai-}resolution camera hpe bang da ai.
San sagawn ai lam hpe sa dat u
Sanglang dan ai lam
Technical Parameters ni

Arung arai jahpan

 

MPC semiconductor hpe jep joi ai arung arai ni gaw CMOS sumla sensor ni a matu hkum tsup ai hku nna, hkum tsup ai hku nna, n-gun rawng ai hku nna, n-gun rawng ai hku nna, n-gun rawng ai hku nna, n-gun n rawng ai hku n-gun dat dat ai ladat langai rai nga ai. Dai hta, ultrafine maigan matter hpe chye na lu ai, n-gun ja ai n-gun n-gun hpe yeng seng kau lu na matu, ga nhpu n-gun rawng ai ladat hpe lam madun ya lu ai, tsaw ai-}resolution camera hpe bang da ai. Substrate/Sensor ntsa na 700nm hta grau kaba ai maigan arai hpe shapraw kau lu ai. Dai jak hpe tsaw ai-}}speed servo modle hpe bang da ai. Single/double station ni hpe galaw shapraw ai atsam hte maren lata la mai ai. Hpaw shapraw lu ai atsam gaw 5000pcs/h hta grau law ai. Shi gaw shiga ni hpe shapraw nna MAP sumla ni hpe shapraw lu ai. Dai aten hta sha, dai data ni hpe customer a MES system de upload galaw mai ai.

 

Product Features ni

 

Dawdan ai lam hte san seng ai lam, DB hpe sawk sagawn ai

 

Product a arung arai ni

1

Baseline : (36pcs/Tray, 10% Dust Rate)

2

Single Station: >2500pcs/h; Double Station: >5000p/h

3

MPC Micron Particle Cleaner System(CMOS Image Sensors a matu) gaw shi hkum shi jep yu nna, hkrak hkrak chye na lu ai.

4

Hka hpe jasan jaseng ai, n-gun n-gun n-gun n-gun, n-gun n-gun n-nga ai

Semiconductor inspection equipment Inspection process

Semiconductor jep joi ai arung arai ni jep joi ai lam

 

Arung

 

● Semiconductor (n kaja ai module, Wafer)

2

 

MPC semiconductor hpe jep joi ai arung arai ni gaw, galaw shapraw ai atsam hpe grai kaja hkra galaw ya lu nna, hkai lu hkai sha ai lam hpe grai kaja hkra galaw ya lu ai, htunghking hku nna lata hte sampling hpe galai shai ya lu ai, grau nna manu dan ai-}edd galaw ai arung arai ni hpe batch galaw shapraw na matu grau nna htuk manu ai. Nang grau kaja ai hparan ladat ra ai rai yang, Huizhou Zhongke Advanced Manufacturing Co., Ltd hpe san yu u.

 

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Technical Parameters ni

 

● Detection Accuracy: >0.6μm

● Floating Dust Removal Rate: >99.9%

 

Arung arai ni hpe masat da ai lam

 

Shinggan na kaba ai Size

W1200mm*D10000000mm*H1850mm

Shen yu ai

1000Kg.